Wafer Cleaner, Wafer Grinder, Probe Station, Dicing Saw, Die Bonder, Flip Chip Bonder
THE COMPANY
Wafer Cleaner, Wafer Grinder, Probe Station, Dicing Saw, Die Bonder, Flip Chip Bonder
| Tipo di azienda | Manufacturer & Trading Company |
| Anno di fondazione | 2000 |
| Dipendenti totali | 100 |
| Capacità | ODM, OBM, Sample |
| Termini commerciali | FOB, CIF, EXW |
| Paese | China |
| Indirizzo | Shenzhen, Guangdong, China |
INSIDE THE FACILITY — 5 PHOTOS
Tell the supplier what you need. Your inquiry will be sent directly to them.
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