Wire Bonder, Soldering Machine, Bond Tester, Grinder and Polisher, Dicing Saw, Die Bonder, Glue encapsulate machine, Parallel sealing welding machine, Laser sealing welder, Laser solder ball placement, Glove box, Plasma surface treating equipment, DMD maskless Lithography, Mask aligner, Wafer grinder, Wafer mounter, Dincing saw, Reactive ion etching system (RIE), Inductively coupled plasma (ICP), Wafer inspector, Terminal insertion machine, Ultrasonic welding machine, PCB cutter, Resistance weld
THE COMPANY
Wire Bonder, Soldering Machine, Bond Tester, Grinder and Polisher, Dicing Saw, Die Bonder, Glue encapsulate machine, Parallel sealing welding machine, Laser sealing welder, Laser solder ball placement, Glove box, Plasma surface treating equipment, DMD maskless Lithography, Mask aligner, Wafer grinder, Wafer mounter, Dincing saw, Reactive ion etching system (RIE), Inductively coupled plasma (ICP), Wafer inspector, Terminal insertion machine, Ultrasonic welding machine, PCB cutter, Resistance weld
| Tipo di azienda | Manufacturer & Trading Company |
| Anno di fondazione | 2014 |
| Categorie principali | Machinery |
| Termini commerciali | EXW |
| Paese | China |
| Indirizzo | Room 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China |
| Prodotti | 19 annunci attivi |
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