High End Fully Automatic Semiconductor Molding Equipment for Lead Frame/Substrate
USD 500000,00 – 1000000,00
MOQ 1 set
Machinery
Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting
THE COMPANY
Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting
| Tipo di azienda | Manufacturer & Trading Company |
| Anno di fondazione | 2019 |
| Categorie principali | Machinery, Packaging & Printing |
| Capacità | OEM,ODM |
| Termini commerciali | FOB,CIF,CFR,EXW |
| Paese | China |
| Indirizzo | Room 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China |
| Prodotti | 19 annunci attivi |
INSIDE THE FACILITY — 5 PHOTOS
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