Automatic Laser Cutting Machine, Laser Drilling Machine, Laser Wafer Marking Equipment
THE COMPANY
Automatic Laser Cutting Machine, Laser Drilling Machine, Laser Wafer Marking Equipment
| Tipo di azienda | Manufacturer & Trading Company |
| Anno di fondazione | 2013 |
| Dipendenti totali | 182 |
| Capacità | ODM,OEM,OBM,Sample |
| Termini commerciali | FOB,EXW,CIF |
| Paese | China |
| Indirizzo | Floor 1-2, Building B, Jingang Science Park, Qiaotou Community, Fuyong Street, Baoan District, Shenzhen, Guangdong, China |
INSIDE THE FACILITY — 5 PHOTOS
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